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SMT Electronics Manufacturer
Mar 08, 2018

  In the electronic application of intelligent technology, multimedia, networking trends, SMT technology came into being. With the development of various disciplines, SMT rapidly developed and popularized in the 90's and became the mainstream of electronic assembly technology. It not only changed the traditional electronic circuit assembly concept, its high density, high speed, standardization and other characteristics in the circuit assembly technology has accounted for an absolute advantage.

It has played an important role in promoting the development of contemporary electronic information industry and has become one of the indispensable technologies for manufacturing modern electronic products. At present, it has been saturated with aviation, medical, automotive, telecommunications, household appliances, lighting and other industries in various fields, a wide range of applications.

SMT surface mount technology include: solder paste printing, component placement, reflow soldering three main production processes. Product quality is the core of all manufacturing companies, it is like the cornerstone of tall buildings, the achievements of enterprises to the peak.

Among them, the quality of solder paste printing surface mount the greatest impact, according to industry evaluation analysis, in the exclusion of PCB design and incoming quality problems, more than 60% of the assembly defects are caused by poor solder paste printing, therefore , To enhance the quality of solder paste printing is particularly important.

First of all, for the popularization of electronics manufacturing staff basic knowledge of SMT, electronics factory to make clear that the entire PCBA production process is not easy, this small series specifically DIP DIP and SMT chip production line finishing the main station into a flow chart, Hope you can be clear at a glance, clearly remember the production line is divided into paragraphs and the division of the station.

Electronic factory SMT and DIP production process flow chart:

With the development of electronic products in the short, small, light and thin, 0201, 1005 and other chip components as well as fine pitch devices such as SOIC, QFP, BGA and CSP are widely used, and more are proposed for the solder paste printing process and equipment High demand.

To meet the fine pitch and lead-free process requirements to prevent the occurrence of defects after reflow, we must understand the printing process requirements, the basic knowledge of solder paste, printing parameters set and its inherent principles, the correct use of solder paste, Good printing process control, in order to effectively control and improve the quality of solder paste printing.

Paste manufacturers in the industry well-known analysis: With the electronic products to the short, small, light, thin direction, triggering the package to smaller, thinner, faster, more convenient and more reliable structural changes. In this market trend, smaller 01005 devices than 0201 devices and 0.35MM pitch chips are being promoted and applied, which means that the difficulty of SMT assembly will be significantly increased. The miniaturization of the pad size and pitch will significantly reduce the difficulty of tin and solder paste solder paste, now No. 4 powder solder paste in the 01005 devices and 0.35mm fine pitch chip printing will be difficult to meet the demand, how to improve quality and increase The reliability of solder joints solder paste application performance put forward new requirements, a new generation of more fine powder --- No. 5 powder solder paste selection will become the industry trend.

Businesses in the industry are also widely recognized to be good welding, quality and long-term reliable products, we must first of all attention is the solder paste printing. Production not only to master and use of solder paste printing technology, and asked to be able to analyze the causes of the problems, and the improvement measures applied to the production practice.