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SMT Chip Processing The Future Trend
Jan 15, 2018

  The SMT Industry Revolution is now an interesting time to change technology and industry practices. For more than 50 years, welding has proven to be a reliable and effective electronic coupling process. However, pursuing human resources capable of handling new materials, soldering temperature, electrical characteristics, mechanical strength and other welding characteristics are good, eliminating unnecessary factors such as solvent cleaning and solvent gas outflow.

Over the past two decades, adhesive manufacturers have evolved to break the welding barriers they consider worth considering in today's marketplace.

Because of the presence of the IMC, it is outlined in the first of the following features so that the "quasi-compound" processing of the chip can write an expression so that very different raw metal properties are better than the entire knot It has different effects on strength: SMT Patch red plastic with a viscous flow, temperature characteristics, wetting properties. Depending on the properties of the red plastic, the purpose of using red plastic is to firmly fix the part to the PCB surface to prevent it from falling.

Due to its unique properties such as viscosity, fluidity, wetting, etc., the unique conditions of SMT plastic and standard management are used as a treatment for the temperature of red plastic patches. The red plastic has a specific serial number, depending on the feed, date, model number. Red plastic can affect the performance of refrigerators stored at 2-8 ° C to prevent temperature changes.

Chip processing miniaturization

SMT Processing Hybrid Microelectronics, Sealed Packaging and Sensor Technology: The widespread use of epoxy resins, the primary reason these systems have a box-like package for packaging electronic circuits, is the use of hybrid microelectronics and hermetic packages. This package protects the electronics against damage to parts and adhesives. Soldering is also used for secondary connections where traditional damage handling issues need to be considered, but since the entire electronics package is hermetically sealed, no soldering may be required.

Since SMT processing, lead-tin bonding has been the main way to connect the electronics industry. At present, Japan, Europe and North America are implementing laws to reduce the use of manufacturing lead. This movement has been seeking alternatives to traditional welding processes and is gaining increasing prominence in the electronics and semiconductor industries. Packaging for most hybrid microelectronic military electronics is also widely used as a dual airbag explosion (under the hood) with this control and for some applications automotive industrial dashboards for engine control and timing mechanisms s installation. Sensor technology also uses pressure-sensitive adhesives to seal pressure sensors, motion, light, sound, and vibration sensors. Conductive pastes have proven to be reliable and effective bonding methods for these applications.