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Industrial Pcb Assembly Process
Jul 27, 2017

In electronic products, with the small, lightweight, thin and high-performance components of the dramatic increase in the use of industrial pcb assembly technology is becoming increasingly important, the relationship between assembly materials and environmental protection are increasingly close. The same time as

People want to develop new lead-free soldering technology that can use the original equipment and processes. 2) has a melting point close to Sn-Pb eutectic; 3) excellent electrical properties, mechanical properties and chemical properties; 4) with the existing process and equipment phase Compatible; 5) suitable for the current assembly welding; 6) can be applied to fine graphics. But unfortunately has not yet found to fully meet the above requirements of the lead-free alternatives. The same time as

  As the components are increasingly miniaturization and narrow spacing, melting welding limit has been placed in front. Industrial pcb assembly and in order to maintain the human living environment, welding lead-free is very urgent. Driven by these factors, the development of solderless connection technology is put on the agenda. The same time as

In fact, IC chip wire bonding is a solderless connection technology, such as ultrasonic bonding (the use of aluminum plastic and ultrasonic vibration chopper, the aluminum lead button on the chip and the shell of the pad) and hot Welding (using high temperature melting and pressurized welding method, the gold wire bond on the chip and the shell of the pad) and so on. Originally, they are limited to the assembly of special components, but have now developed a variety of ultra-micro-connection methods that connect ICs to the electrodes of the front panel. The same time as

The IC chip with gold-plated solder bumps or gold solder balls can be directly connected to the substrate electrodes by using conductive adhesive (Ag, Cu, etc.), and the insulating resin is filled between the element and the substrate to alleviate the difference Produce thermal stress. To ensure the reliability of assembly. This technology has been used in IC chip assembly for liquid crystal displays and mobile phones. It has recently been reported that fine pitch connections of less than 50 mm have also been practical. The future of these methods is to reduce the scope of application of the expanded resistance of the contact resistance. In the environmental protection to the electronic assembly industry before the severe challenge, no flux connection because no need to clean and simplify the process more and more attention. The same time as

The total strategy for controlling the use and emission of VOCs is divided into the following aspects: the use of VOCs in closed or recyclable systems; the development of fusible fluxes, solder and flux-free resins to reduce VOC usage; Surfactants instead of organic solvents and so on. In general, due to the variety of industrial pcb assembly, different performance, its control research is still the beginning stage.