Add:No.18, Tannan Road, Tanjia Industrial Village, Gongming Street, Guangming New District, Shenzhen, China
Flip Chip Technologies
Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different formspcb assembly, shenzhen pcb assembly, china pcb assembly, electronics contract manufacturing services, pcba and pcb printed circuit boards assembly services, china supplier manufacturer, Topscom Technology.
Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, including:
Solder Bumped Flip Chip Technology
Anisotropic Conductive Adhesive Flip Chip Technology
Ultrasonic Bonding Flip Chip Technology
In addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.
Topscom Technology is one of the leading manufacturers and suppliers who is committed to provide customers high quality and customized flip chip technologies. Our factory can also give you wholesale service which is made in China, welcome to get flip chip technologies with us.